Seminar: Technological Challenges of Functional Printing applied to Industrial Packaging

Seminar: Technological Challenges of Functional Printing applied to Industrial Packaging
On September 29 do not miss the seminar Technological Challenges of Functional Printing Applied to Industrial Packaging organized by the 3Neo platform and PACKNET Cluster Functional Print. Raquel Gonzalez will give a talk on active and intelligent materials for next generation packaging.

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